1 / 4 www.asb.co.kr april 2009 p lerow tm acl4300t2 internally matched lna module the plerow tm a c l - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application sy stem environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 4200 4400 gain db 19 20 gain flatness db ? 0.9 ? 1.0 noise figure db 1.25 1.30 output ip3 (1) dbm 29 30 s11 / s22 (2) db - 18 / - 10 output p1db dbm 13 14 switching time (3) ? sec - supply current ma 50 60 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 29 ~ 31 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of 4 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 vs other s ground ou t line drawing (unit: mm) s 21 = 20.9 db @ 4200 mhz = 19.1 db @ 4400 mhz nf of 1.25 db over frequency unconditionally stabl e single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. (recommended footprint) acl4300t2 asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 2 - stage single type specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. = 4300 mhz, z o.sys = 50 ohm feature s description
2 / 4 www.asb.co.kr april 2009 p lerow tm acl4300t2 internally matched lna module s - param e ters noise figure oip3 p1db 4200~4400 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr april 2009 p lerow tm acl4300t2 internally matched lna module 1. s - parameter 2. oip3, p1db & nf note: tested at room temperature. 1. s - parameter 2. oip3, p1db & nf note: tested at v s = 5 v . 4200 mhz 4300 mhz 4400 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s 21 (db) s11 (db) s22 (db) 4.50 v 21.94 - 19.16 - 15.44 21.21 1.57 - 23.09 - 17.93 20.37 - 23.50 - 15.42 4.75 v 22.16 - 19.59 - 15.30 21.44 1.58 - 23.89 - 17.80 20.58 - 24.42 - 15.26 5.00 v 22.35 - 19.74 - 15.27 21.62 1.58 - 24.48 - 17.70 20.77 - 25.01 - 15.15 5.25 v 22. 49 - 20.14 - 15.15 21.78 1.58 - 25.10 - 17.62 20.91 - 25.68 - 14.97 5.50 v 22.62 - 20.36 - 15.02 21.90 1.60 - 25.63 - 17.52 21.02 - 25.96 - 14.86 4200 mhz 4300 mhz 4400 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) 4.50 v 29.77 15.21 1.001 27.22 14.92 1.060 28.25 14.72 1.052 4.75 v 32.15 15.67 1.020 28.67 15.49 1.045 29.69 15.20 1.065 5.00 v 32.32 16.14 1.026 29.98 15.98 1.059 30.98 15.65 1.068 5.25 v 33.27 16.56 1.035 31.02 16. 46 1.072 32.31 16.11 1.072 5.50 v 34.32 16.93 1.047 32.19 16.83 1.084 33.37 16.41 1.083 4200 mhz 4300 mhz 4400 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) - 45 ? c 23.18 - 19.38 - 10.38 22.55 1.59 - 22.08 - 12.40 21.59 - 26.84 - 13.34 - 10 ? c 22.82 - 22.03 - 12.15 22.23 1.51 - 26.09 - 13.67 21.31 - 22.68 - 15.21 25 ? c 22.39 - 23.36 - 13.43 21.86 1.36 - 27.47 - 14.04 21.03 - 21.34 - 15.84 60 ? c 22.07 - 25.89 - 12.65 21.48 1.24 - 27.70 - 15.23 20.59 - 20.83 - 16.28 85 ? c 21.73 - 27.23 - 13.02 21.15 1.48 - 28.05 - 15.86 20.25 - 20.82 - 16.24 4200 mhz 4300 mhz 4400 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) - 45 ? c 30.1 15.1 0 .538 31.0 14.5 0.564 29.6 14.0 0.585 - 10 ? c 30.2 15.3 0.764 30.9 14.7 0.788 29.8 14.2 0.823 25 ? c 30.2 15.0 1.038 30.5 14.4 1.063 29.8 14.2 1.089 60 ? c 30.0 15.0 1.337 30.4 14.4 1.363 29.8 14.2 1.390 85 ? c 29.4 15.0 1.587 29.6 14.3 1.613 29.1 14.2 1.63 8 rf performance with operating temperature rf performance with voltage change
4 / 4 www.asb.co.kr april 2009 p lerow tm acl4300t2 internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply statu s . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf s ignal to pass and blocking the dc component in the signal. the dc blocking capacitors are inclu d- ed inside the aln module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is det ermined by considering the application fr e- quency. application circuit recommended soldering reflow process 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) + - acl out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor in out vs size 25x25mm (for acl - t series C 10x10mm) evaluation board layout
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